KIIT Deemed to be University SDT Quiz (Activity-4) Topic: Module-2 and Module-3 âąī¸ 20:00 đ 10 Questions 1 Registration & Summary âšī¸ Quiz Summary Main Topic Topic: Module-2 and Module-3 Questions 10 Items Time Limit 20 Minutes Negative Marking â None Name * Roll Number * Ready to begin? The timer starts immediately. đ Continue & Start Test 2 Quiz Questions Q1. What is the typical wavelength of the light source used in i-line lithography? 13.5 nm 193 nm 365 nm 248 nm Q2. What critical step must immediately follow ion implantation to make the dopants electrically active and repair the silicon lattice? Wet chemical etching Chemical Mechanical Polishing (CMP) High-temperature annealing A second implantation step Q3. What is the core business model of a pure-play foundry? Designing consumer electronics Manufacturing chips based on designs provided by other companies Selling proprietary software tools Mining raw silicon Q4. What was the major industry shift that led to the rise of the fabless-foundry model? The skyrocketing capital costs required to build modern chip factories The ban on international chip trading The invention of the vacuum tube The decreasing cost of building fabrication plants Q5. An etching process that removes material at the exact same rate in all directions (vertically and horizontally) is called: Isotropic Anisotropic Reactive-ion Highly selective Q6. According to Rayleigh's criterion, the minimum resolvable feature size (resolution) in lithography is proportional to the light's wavelength and inversely proportional to what parameter? Wafer diameter Numerical Aperture (NA) Photoresist thickness Exposure time Q7. Which phase directly follows wafer fabrication in the standard semiconductor value chain? Retail distribution System integration Circuit design Wafer sorting and testing Q8. If you look at the cross-section of a modern integrated circuit, what forms the lowest active layer directly built into the silicon substrate? The plastic package The solder bumps The metal interconnects The transistors Q9. Dennard Scaling stated that as transistors get smaller, their power density stays constant. Why has this scaling law largely ended in recent years? Copper interconnects replaced aluminum Sub-threshold leakage currents and threshold voltages could not be scaled down indefinitely Transistors became too heavy Wafers became too small Q10. What is the primary purpose of Self-Aligned Double Patterning (SADP)? To eliminate the need for etching To reduce the cost of the photoresist To effectively double the resolution limits of a lithography tool To increase the wafer thickness đ¯ Complete My Submission
